The LPKF ProtoLaser U3 is suited for the micromaterial processing with laser technology. More information:
http://www.lpkf.com/product...The ProtoLaser U3 can make prototypes and is also suitable for small series production and for production of individual components with high variance.
The UV laser beam separates individual circuit boards from large printed boards, cuts LTCC and prepregs, drills holes and microvias or structures FR4 substrates.
The ProtoLaser U3 cuts a multitude of materials and is suited for structuring metallic and organic resists. The LPKF ProtoLaser U3 can process most varied materials like ceramic, LTCC (green tape), FR4, Rogers, protective sheets and metal foils or flexible and flex-rigid materials.
The LPKF ProtoLaser U3 is suited for the micromaterial processing with laser technology. More information:
http://www.lpkf.com/product...The ProtoLaser U3 can make prototypes and is also suitable for small series production and for production of individual components with high variance.
The UV laser beam separates individual circuit boards from large printed boards, cuts LTCC and prepregs, drills holes and microvias or structures FR4 substrates.
The ProtoLaser U3 cuts a multitude of materials and is suited for structuring metallic and organic resists. The LPKF ProtoLaser U3 can process most varied materials like ceramic, LTCC (green tape), FR4, Rogers, protective sheets and metal foils or flexible and flex-rigid materials.
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